1.說明
BGA氣泡小，空洞率低，印刷好，,手機(jī)，電腦主板,尤其是密間距元件印刷性較好。
品質(zhì)：
化學(xué)成分：
該Solder Paste 使用高品質(zhì)真圓球形粉末,其成分如 表-1所列： 表-1 金屬成分
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Sn%
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Ag%
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Cu%
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Pb%
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Sb%
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Bi%
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Zn%
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Fe%
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Al%
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As%
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Cd%
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余量
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3.0±0.2
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0.5±0.05
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＜0.05
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≤0.10
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≤0.05
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≤0.001
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≤0.02
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≤0.001
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≤0.03
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＜0.002
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粉末顆粒范圍:№粉末尺寸(μm)及目數(shù)相應(yīng)代號(hào) ①45~25(-325/500)C ②38~20(-400/635)D
2.2 特性：
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該Solder Paste 的特性如表-2所列：
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表-2 特性值
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項(xiàng)
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目
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特 性 值
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試 驗(yàn) 方 法
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Flux %
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11.5 ± 0.5
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JIS Z 3197 - 8.1.2
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助焊劑含量 %
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Chlorine conten in Flux %
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0.08 ± 0.02
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電位差自動(dòng)滴定
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氯素含量 %
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Copper plate Corrosion
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未發(fā)生
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JIS Z 3284 - 4
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銅板腐蝕
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Water solution resistance Ω cm
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> 5×104
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水溶液阻抗 Ω cm
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JIS Z 3197 - 8.1.1
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Insulation resistance
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Ω cm
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40℃
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> 1×10
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11
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JIS Z 3284 - 3
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絕緣阻抗 Ω cm
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90%
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Migration
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無
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JIS Z 3284 - 14
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遷移試驗(yàn)
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Spreading %
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> 80
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JIS Z 3197(- 8.3.1.1
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擴(kuò)散率 %(CuO板)
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Viscosity
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Pa.s
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190±30
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Malcom PCU-205: 10rpm 3min
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粘度 Pa.s
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Melting
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point ℃
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217-221
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-
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融點(diǎn) ℃
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Solder ball test
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等級(jí)1~3
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JIS Z 3284 -11
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錫球試驗(yàn)
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適宜印刷間距
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GMC-M305-C-885 : ≥0.4
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-
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(mm)
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GMC-M305-D-885 : ≥0.3
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Slump-in-printing
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0.2mm
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JIS Z 3284 - 7
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印刷塌陷
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Slump-in-heating
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0.3mm
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JIS Z 3284 - 8
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加熱塌陷
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Tackiness(time tacking force is
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24hr
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JIS Z 3284 - 9
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粘著性(1.2N以上保持時(shí)間)
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流動(dòng)特性
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0.50~0.70
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JIS Z 3284 - 6
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Fluidity characteristic(Ti)
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3.產(chǎn)品特點(diǎn)：
3.1本產(chǎn)品采用敝司最新開發(fā)的助焊劑而具有優(yōu)異的粘度穩(wěn)定性;常溫(∠35℃)下保質(zhì)期為2個(gè)
月,方便運(yùn)輸及保管;
3.2本產(chǎn)品在高溫高濕環(huán)境下,連續(xù)使用粘度穩(wěn)定性非常佳;
3.3連續(xù)印刷7天,本產(chǎn)品仍可保持優(yōu)良的性能,減少消耗量;
3.4有效減少空洞率及錫珠;
3.5有效抑制BGA虛焊的發(fā)生.
在線咨詢 
